5105
Highly-thixotropic, high-temperature, heat-cure adhesive for applications which require non-sagging during cure. Excellent bond strength, high heat distortion, excellent heat transfer properties, and good chemical resistance.
Highly-thixotropic, high-temperature, heat-cure adhesive for applications which require non-sagging during cure. Excellent bond strength, high heat distortion, excellent heat transfer properties, and good chemical resistance.