Heat / Bake Class F Rotor Single-component epoxy which forms a ‘B-stage’ coating when allowed to dry. Dry to the touch when B-staged to allow movement of coated parts, prior to bake/bonding 3096 Heat / […]
Bonding Parts To Copper Read More »
Room Temp Class B Multiple Thixotropic, quick-curing multi-substrate epoxy adhesive for use over a wide temperature range. 3328-3909 Room Temp Class F Multiple Medium viscosity, quick-curing multi-substrate adhesive for quick bonding, insulating, patching, and filling
Fast Curing, Multi-Purpose Adhesives Read More »
Room Temp Class B Multiple Flowable epoxy adhesive exhibiting outstanding flexibility, resilience, peel strength, and excellent multi-substrate adhesion. MB-14X Room Temp Class B Multiple Thick, filled adhesive exhibiting outstanding flexibility, resilience, peel strength, and excellent
General Purpose, Multi-Substrate Adhesives Read More »
Room Temp Class F Stator / Frame Flexible, thixotropic, epoxy adhesive for bonding porous substrates and most elastomers, including Butyl and Neoprene rubber to metal parts. 6001
Bonding Rubber Seals & Baffles Read More »
Room Temp Class B Stator General purpose ‘Peanut Butter’ epoxy paste typically used as a ‘hardware epoxy’ for locking end-wedges, bolts, and filling larger gaps and voids in Class B and Class F generators and
Pastes for securing wedges, bolts & hardware Read More »
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